TY  - BOOK
AU  - Shenglin Ma
TI  - TSV 3D RF Integration: High Resistivity Si Interposer Technology
SN  - 9780323996020
PY  - 2022///
CY  - Elsevier
PB  - Elsevier
UR  - https://www.sciencedirect.com/science/book/9780323996020
ER  -