Bar-Cohen Avram Et Al <br/><br/>
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology A 4-Volume Set 

 -  World Scientific  WSPC  2019 
<br/><br/><label>ISBN: </label>9789811209635 
<br/><br/><label>Source: </label>EBOOK 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering / Acoustics