TY  - BOOK
AU  - Bar-Cohen Avram Et Al
TI  - Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology A 4-Volume Set
SN  - 9789811209635
PB  - World Scientific
KW  - Engineering / Acoustics
UR  - https://www.worldscientific.com/worldscibooks/10.1142/11303#t=toc
ER  -