TY  - BOOK
AU  - Cho J-D Et Al
TI  - High Performance Design Automation for Multi-Chip Modules and Packages
SN  - 9789812830852
PB  - World Scientific
KW  - Engineering / Acoustics
UR  - https://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc
ER  -