| 000 | 00559nam a2200193Ia 4500 | ||
|---|---|---|---|
| 005 | 20260119144212.0 | ||
| 008 | 008 260114s9999 xx 000 0 eng d | ||
| 020 | _a9780323996020 | ||
| 037 | _aEBOOK | ||
| 040 |
_aCRL _beng _cCRL |
||
| 041 |
_aeng _2eng |
||
| 084 | _qCRL | ||
| 100 |
_aShenglin Ma _9902820 |
||
| 245 | 0 | _aTSV 3D RF Integration: High Resistivity Si Interposer Technology | |
| 260 |
_aElsevier _bElsevier _c2022 |
||
| 856 | _uhttps://www.sciencedirect.com/science/book/9780323996020 | ||
| 942 | _cEBOOK | ||
| 999 |
_c1494911 _d1494911 |
||