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_aBar-Cohen Avram Et Al _9952755 |
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| 245 | 0 | _aEncyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology A 4-Volume Set | |
| 260 | _bWorld Scientific | ||
| 260 | _bWSPC | ||
| 260 | _c2019 | ||
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_aEngineering / Acoustics _9952756 |
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