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| 005 | 20260320201001.0 | ||
| 008 | 008 262003s9999 xx 000 0 eng d | ||
| 037 | _aEBOOK | ||
| 040 | _aCRL | ||
| 040 | _beng | ||
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| 041 | _2eng | ||
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_aKeser _91133958 |
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| 245 | 0 | _aAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies | |
| 260 | _bIEEE | ||
| 260 | _c2019 | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=8726249 | ||
| 942 | _cEBOOK | ||
| 999 |
_c1718086 _d1718086 |
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