| 000 | 00873nam a2200277Ia 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20220928124348.0 | ||
| 006 | a|||||r|||| 00| 0 | ||
| 007 | ta | ||
| 008 | 220927b |||||||| |||| 00| 0 eng d | ||
| 020 | _c6532.732 | ||
| 024 | _a105978 | ||
| 037 |
_b2430, 25/01/2010, New India Book Agency _cTextual |
||
| 040 |
_aSDCL _cSDCL _beng |
||
| 041 |
_2eng _aeng |
||
| 082 | _aD65264, Q0 | ||
| 100 |
_aKuang Ken Ed. _9464646 |
||
| 245 | 0 |
_cKuang Ken Ed.; Kim Franklin Ed.; Cahill Sean S Ed. _aRF and Microwave Microelectronics Packaging |
|
| 260 |
_aNew York _b Springer _c2010 |
||
| 300 |
_axvi, 285p _ccm. |
||
| 650 | _aElectronic Science | ||
| 700 |
_a Cahill Sean S Ed. _9464647 |
||
| 700 |
_a Kim Franklin Ed. _9464648 |
||
| 942 |
_hD65264, Q0 _cTEXL _2CC |
||
| 999 |
_c777538 _d777538 |
||